W3H32M72E-533SB2I
32M X 72 DDR DRAM, 0.65 ns, PBGA208

From Microsemi Corp.

StatusACTIVE
Access ModeFOUR BANK PAGE BURST
Access Time-Max (tRAC)0.6500 ns
Memory Density2.42E9 deg
Memory IC TypeDDR DRAM
Memory Width72
Mfr Package Description16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
Number of Functions1
Number of Ports1
Number of Terminals208
Number of Words3.36E7 words
Number of Words Code32M
Operating ModeSYNCHRONOUS
Operating Temperature-Max85 Cel
Operating Temperature-Min-40 Cel
Organization32M X 72
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleGRID ARRAY
Supply Voltage-Max (Vsup)1.9 V
Supply Voltage-Min (Vsup)1.7 V
Supply Voltage-Nom (Vsup)1.8 V
Surface MountYes
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTIN LEAD
Terminal FormBALL
Terminal Pitch1 mm
Terminal PositionBOTTOM

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