WS128K32NV-25H1I
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66

From Microsemi Corp.

StatusACTIVE
Access Time-Max (tACC)25 ns
Alternate Memory Width16
Memory Density4.19E6 deg
Memory IC TypeMULTI DEVICE SRAM MODULE
Memory Width32
Mfr Package Description1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Number of Functions1
Number of Terminals66
Number of Words131072 words
Number of Words Code128K
Operating ModeASYNCHRONOUS
Operating Temperature-Max85 Cel
Operating Temperature-Min-40 Cel
Organization128K X 32
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeSQUARE
Package StyleGRID ARRAY
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)3.6 V
Supply Voltage-Min (Vsup)3 V
Supply Voltage-Nom (Vsup)3.3 V
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FormPIN/PEG
Terminal Pitch2.54 mm
Terminal PositionPERPENDICULAR

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