WS1M32V-17G3MA
1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP84

From Microsemi Corp.

StatusACTIVE
Access Time-Max (tACC)17 ns
Memory Density3.36E7 deg
Memory IC TypeMULTI DEVICE SRAM MODULE
Memory Width32
Mfr Package Description28 MM, CERAMIC, QFP-84
Number of Functions1
Number of Terminals84
Number of Words1.05E6 words
Number of Words Code1M
Operating ModeASYNCHRONOUS
Operating Temperature-Max125 Cel
Operating Temperature-Min-55 Cel
Organization1M X 32
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeRECTANGULAR
Package StyleFLATPACK
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)3.6 V
Supply Voltage-Min (Vsup)3 V
Supply Voltage-Nom (Vsup)3.3 V
Surface MountYes
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishTIN LEAD
Terminal FormGULL WING
Terminal PositionQUAD

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