WS512K32-35G2LIA 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
From Microsemi Corp.
Status | ACTIVE |
Access Time-Max (tACC) | 35 ns |
Alternate Memory Width | 16 |
Memory Density | 1.68E7 deg |
Memory IC Type | MULTI DEVICE SRAM MODULE |
Memory Width | 32 |
Mfr Package Description | 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
Number of Functions | 1 |
Number of Terminals | 68 |
Number of Words | 524288 words |
Number of Words Code | 512K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -40 Cel |
Organization | 512K X 32 |
Package Body Material | CERAMIC, METAL-SEALED COFIRED |
Package Shape | SQUARE |
Package Style | FLATPACK |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 5.5 V |
Supply Voltage-Min (Vsup) | 4.5 V |
Supply Voltage-Nom (Vsup) | 5 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | NOT SPECIFIED |
Terminal Form | GULL WING |
Terminal Pitch | 1.27 mm |
Terminal Position | QUAD |