XR2A-0811-N
CONN IC DIP SOCKET 8POS GOLD

From Omron Electronics Inc-EMC Div

CategoryConnectors, Interconnects
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Finish Thickness - Post10µin (0.25µm)
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
Contact Resistance20 mOhm
Current Rating1A
DatasheetsXR2
FamilySockets for ICs, Transistors
FeaturesOpen Frame
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)8 (2 x 4)
Operating Temperature-55°C ~ 125°C
Other NamesXR2A0811N
Other Related DocumentsHow to Read Date Codes
PackagingBulk
Pitch - Mating0.100" (2.54mm)
Pitch - Post0.100" (2.54mm)
SeriesXR2
Standard Package60
TerminationSolder
Termination Post Length0.126" (3.20mm)
TypeDIP, 0.3" (7.62mm) Row Spacing

External links