K3P7Q1000B-FC10 4M X 16 MASK PROM, 100 ns, PBGA48
From Samsung Semiconductor Division
Status | ACTIVE |
Access Time-Max (tACC) | 100 ns |
Alternate Memory Width | 8 |
Memory Density | 6.71E7 deg |
Memory IC Type | MASK PROM |
Memory Width | 16 |
Mfr Package Description | 0.75 MM PITCH, FBGA-48 |
Number of Functions | 1 |
Number of Terminals | 48 |
Number of Words | 4.19E6 words |
Number of Words Code | 4M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 70 Cel |
Operating Temperature-Min | 0.0 Cel |
Organization | 4M X 16 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | SQUARE |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 3.3 V |
Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 0.7500 mm |
Terminal Position | BOTTOM |